Title: Advanced International Technology
Description: AIT provides thin film fabrication services: deposition, sputtering, photolithography, etching / lift off. Back end wafer processing: dicing, wire bonding, ion milling, micro-machining & assembly. Biotechnology in Mems and Nanotechnology applications.
Keywords:
Mems,
Sputtering,
Solar,
Array,
Photolith,
Wafer Dicing,
Micro-machining,
cnc machining,
wirebonding,
wire bonding,
grinding,
polishing,
slicing,
cable assembly,
glass bonding,
epoxy bonding,
precision surface grinding,
assembly,
magnetic heads,
heads,
sensors,
semiconductors