#16,158,778 (0%) - icproto.com
Title: IC Packaging | Custom IC Assembly Services | Air Cavity QFN | Wafer Preparation | Unlimited Packaging Solutions | Quik-Pak
Description: Quik-Pak provides microelectronic packaging, IC packaging, wire bonding, advanced assembly and prototyping services for fabless semiconductor companies enabling faster time to market for new devices.
Keywords:ic packaging, ic package, QFN packages, air cavity packages, air cavity qfn, wire bonding, ic packages, wafer backgrinding, wafer thinning, pick and place, ic assembly, wafer dicing, ic prototypes, wire bond, bga, flip chip, die thinning, ic encapsulation, radiation detector, laser machining, die sort, open cavity plastic package, chip-on-board, stacked die, mems,
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