Title: CHIPS-INC, Custom wafer to die processing
Description: CHIPS-Inc.wafer to die processing for the semi-conductor industry. Mil I 45208A compliant Class10000 certified clean rooms,Class1 ESD NARTE Certified.
Keywords:Chips, wafers, die processing tape reel, semi conductor, wafer back lapping, wafer sawing, wafer saw, Gallium Arsenide, dicing, grinding, thinning, silicon, sapphire, glass cutting, die sawing, Pick and place, bumped die, map picking, ink less, diodes, transistors, IC’s, cmos, Inspection, industrial,
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